The two areas, thermal management and electronic enclosures, seem to go hand in hand, although electronic enclosures typically have many other needs in addition to thermal management. As a result, SDC takes a multifunctional approach to enclosures, that is, enclosures must meet EMI, radiation hardness (natural and threat induced), structures and vibration, thermal, but most importantly cost and weight goals and objectives.

In one program, SDC is developing a multifunctional electronic enclosure for a missile application that operates both endo and exo-atmosphere. The lightweight composite material will incorporate a variety of materials, some which are being developed in other programs (e. g., Buckey Paper). The electronics will incorporate an advanced heat sink approach that will replace the traditional beryllium material, which combines an advanced high heat capacity material and phase change.

High power Gallium Arsenide, Gallium Nitride, and Silicon Carbide are all being developed for a variety of future applications include wide bandgap phased array radar. These new devices are generating heat fluxes on the order of 1,000 Watts/cm2, which far exceeds state of the art technologies for heat spreading and conduction. SDC, in concert with its academia partner, Auburn University, has developed a Liquid Metal Micro-heat Pipes1 (LMMHPssm), which has been demonstrated in the laboratory at heat fluxes approaching the goal. In addition, SDC with another partner, has developed a 2D vapor chamber technology based on a unique wicking approach. Combined, these two technologies offer the potential to maintain peak junction temperatures at required levels as well as maintain temperature uniformity at all Transmit Receive Modules in a radar array.

1Patent pending